Chip and substrate fabrication might not be the most exciting topic in the world, but when it could lead to significant performance and efficiency improvements, you'd better bet I'm here for it. So, I'm certainly excited by the news that, according to Business Korea (via Tom's Hardware), AMD is "planning to introduce glass substrates between 2025 and 2026."
Why is this important? Because slapping chips on top of a glass substrates rather than organic ones for chiplet-to-chiplet and chip-to-motherboard communication has all kinds of benefits. We reported in September that Intel is already planning on using glass substrates which has benefits such as "allowing for more chiplets in a smaller footprint, higher interconnect density, faster IO, higher power efficiency, and larger package sizes."
