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The Economic Times
The Economic Times
Technology

Intel taps industry veteran Seok-Hee Lee to lead foundry packaging push

Intel on Thursday named Seok-Hee Lee executive ​vice president of its ​contract chip-manufacturing division as it sharpens focus ​on its advanced packaging business.

The American chipmaker has been trying to reinvigorate its manufacturing business under CEO Lip-Bu Tan, after missing ‌out on ⁠the ⁠AI boom.

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