Intel's processors in LGA1700 packaging have faced serious criticism for bending and, therefore, insufficient cooling in some cases. With its Core Ultra 200S (codenamed Arrow Lake) processors in LGA1851 packaging, Intel not only moved the CPU hotspot north but also adopted a different integrated lever mechanism that improves compatibility with liquid coolers to lower thermals and uses a flat load plate, according to an MSI webcast.
"Intel adopts the new RL-ILM for Intel Core Ultra Processors," a statement by MSI reads. "The new ILM reduces loading force and ensures the liquid cooling fits more securely on the CPU surface, improving heat dissipation efficiency and reduce the CPU temperature about 1-2 degrees."
