India’s semiconductor ambitions got a fresh boost with the signing of a tripartite memorandum of understanding between the Odisha government, Intel Corporation and US-based 3D Glass Solutions Inc (3DGS) on May 29 to establish an advanced packaging glass core substrate manufacturing facility in the state.
The development comes as India sharpens its focus on strategic technologies, including semiconductors, artificial intelligence and electronics manufacturing, amid rising geopolitical competition and growing demand for resilient global supply chains.
