Huawei’s AI silicon roadmap is no longer a state secret. Speaking at the Huawei Connect conference on September 18, rotating chairman Xu Zhijun outlined the company’s first official long-range Ascend chip strategy, with four new parts scheduled across the next three years: Ascend 950PR and 950DT in early 2026, followed by Ascend 960 and 970 in 2027 and 2028, respectively.
Huawei says its upcoming 950PR chip will ship in Q1 next year with in-house HBM designed to compete with the likes of SK hynix and Samsung. That’s a pretty bold claim considering HBM supply and factors like packaging and bandwidth efficiency have arguably become the single biggest constraint on AI accelerator performance at scale.
