Huawei has said it has developed a new chip design approach it claims could help it achieve cutting-edge semiconductor performance within five years, marking a notable development in China's push for technological self-reliance under continued US export restrictions.
At a semiconductor industry conference in Shanghai, Huawei described a shift away from traditional transistor miniaturization toward a stacked architecture approach designed to bypass reliance on extreme ultraviolet lithography equipment that remains restricted under US sanctions introduced in 2019. NBC News reported that the company framed the development as part of a broader effort to strengthen China's domestic semiconductor supply chain amid ongoing technology controls imposed by Washington.
