TAIPEI, June 17, 2026 /PRNewswire/ -- DIGITIMES will host an exclusive webinar on June 30, 2026 (08:30 GMT+8) examining the two structural forces redefining AI computing infrastructure: the architectural shift from monolithic GPU silicon toward application-specific and edge deployments, and the industry's accelerating transition to optical interconnects as electrical bandwidth hits hard physical limits. Drawing on proprietary data from the latest DIGITIMES reports on CPO & Inference AI Compute Architecture, the event offers technology executives, investors, and supply chain strategists actionable intelligence at a moment of rapid market change.
The generative AI build-out that defined 2023–2025 is giving way to a more complex second chapter. As enterprises shift from large-scale cloud training toward distributed inference workloads, the industry's requirements for chip architecture and data center interconnect are diverging sharply. DIGITIMES analysts Eric Huang and Tony Huang — together bringing more than five decades of semiconductor and packaging expertise — will present two focused sessions addressing both dimensions of this transition.
