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Tom’s Hardware
Tom’s Hardware
Technology
Anton Shilov

DARPA invests $1.4 billion to build multi-chiplet 3D processors for military and civilian applications

Texas Institute for Electronics .

DARPA has selected the Texas Institute for Electronics (TIE) at The University of Texas (UT) at Austin to develop 3D-integrated multi-chiplet advanced 'semiconductor microsystems' for the U.S. Department of Defense. This project involves creating a national R&D and prototyping facility to produce high-performance, energy-efficient, lightweight, and compact defense systems. 

A $1.4 billion project

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