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Tom’s Hardware
Tom’s Hardware
Technology
Anton Shilov

AMD's Zen 5 chips pack in 8.315 billion transistors per compute die, a 28% increase in density

AMD Ryzen processor.

When AMD formally introduced its Zen 5-based Ryzen processors for desktops and laptops, it revealed a lot of details about the Zen 5 microarchitecture and capabilities of these CPUs. However, it didn't disclose the actual die sizes and transistor counts of various Zen 5-based products — at least not to the U.S. press. In Germany, representatives for the company were kind enough to reveal this information to HardwareLuxx. 

As it turns out, AMD's 'Eldora' core complex die of the company's Ryzen 9000-series processors packs 8.315 billion transistors, which is significantly more than the Durango Zen 4 CCD, which has 6.5 billion transistors. Yet, because Eldora is made on TSMC's N4P (a 4nm-class) fabrication process, whereas Durango is produced using TSMC's N5 (a 5nm-class) production node, their die sizes are similar—around 71 mm^2. 

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