According to an unconfirmed report from Business Korea, AMD intends to adopt glass substrates for its ultra-high-performance system-in-packages (SiPs) between 2025 and 2026. The report claims the company will work with 'global components companies' on the project. While glass substrates for processors are exotic today, they may be closer to adoption than one might think.
Glass substrates provide notable benefits over conventional organic substrates, so Intel, Samsung, and some other companies are racing to use them in the second half of the decade. The exceptional flatness of glass substrates enables the improved depth of focus for lithography and dimensional stability and is ideal for interconnects in advanced SiPs containing multiple chiplets. Furthermore, glass substrates offer superior thermal and mechanical strength, making them well-suited for high-temperature and durable applications, such as data center-oriented SiPs. That said, glass substrates make great sense for companies like AMD, Intel, and Nvidia.
