A new colloidal thermal interface material (TIM) promises to significantly outperform commercially available liquid metals like Thermalright, Thermal Grizzly, and Coollaboratory products. Researchers at the Cockrell School of Engineering, part of the University of Texas, summarize their new invention as a mechanochemistry-engineered mix of Galinstan alloy and ceramic aluminum nitride. The bottom line is that the new TIM can outperform the best commercial liquid metal alternatives by between 56% and 72%, highlights Golem.de.
According to the researchers, the new TIM could reduce the cost and complexity of cooling power-hungry systems. “The power consumption of cooling infrastructure for energy-intensive data centers and other large electronic systems is skyrocketing,” noted Guihua Yu, professor in the Cockrell School of Engineering’s Walker Department of Mechanical Engineering and Texas Materials Institute. “That trend isn’t dissipating anytime soon, so it’s critical to develop new ways, like the material we’ve created, for efficient and sustainable cooling of devices operating at kilowatt levels and even higher power.” The scientists go on to underline the fact that around 40% of a data center's energy expenditure is on cooling.
