For the first time, scientists have packaged a miniscule silicon chip with a cooling system designed to "actively" keep smartphones cool — rather than relying on "passive" cooling and thermal throttling.
The "xMEMS XMC-2400 µCooling" chip is just 0.04 inches (1 millimeter) thick — slightly thicker than a credit card — and is designed to be fitted into ultramobile devices like smartphones and tablets.
