TSMC's share of the chipmaking market has been increasing, and so has the company's capital expenditure (CapEx), which has increased fivefold since 2015. The company plans to spend between $38 billion and $42 billion on capacity expansion in 2025, with the hopes of building eight semiconductor fabrication facilities and one advanced packaging facility in 2025.
"From 2017 to 2020, every year we built on average three fabs per year," said Dr. Cliff Hou, SVP and Deputy Co-COO at TSMC, at the most recent 2025 North America Technology Symposium. "From 2021 to 2024, we increased to five fabs per year. This year, we will increase to nine new fabs per year to support our strong growth and your business. Among those nine fabs, eight are wafer fabs and one is an advanced packaging facility."
