TSMC to go 3D with wafer-sized processors — CoW-SoW technology allows 3D stacking for the world's largest chips

Intel.

TSMC is taking the wafer-scale fabrication battle into the third dimension with a new technology. At its North American Technology Symposium, it introduced its next-generation system-on-wafer platform—CoW-SoW—that will enable 3D integration with wafer-scale designs. This builds on the InFO_SoW system-on-wafer integration technology technology that TSMC introduced in 2020 that allows it to build wafer-scale logic processors. So far, only Tesla has adopted this tech for its Dojo supercomputer, which TSMC says is now in production

(Image credit: TSMC)