TSMC has suspended the construction of the first phase of its Advanced Backend Fab 7 (AP7) facility in Chiayi Science Park after the discovery of a suspected archaeological site earlier this month. This halt comes in compliance with cultural heritage procedures, and TSMC has proposed the construction of a second phase of the plant first, as a contingency plan. It has got full support from the Southern Taiwan Science Park Administration, reports LTN.
TSMC's Advanced Backend Fab 7 will cost TSMC several billions of dollars and will be equipped to handle advanced backend packaging technologies like integrated fan-out (InFO) and Chip-on-Wafer-on-Substrate (CoWoS), which are used in such processors as Nvidia's A100, H100, and B100/B200. Given the scale and timing of the facility development, it is also set to support TSMC's SoIC (System on Integrated Chips) packaging methods, including frontend 3D stacking techniques such as chip-on-wafer (CoW) and wafer-on-wafer (WoW), which will enable TSMC to build vertically stacked products like AMD's Instinct MI300.
