TSMC says its newest process tech doesn't need ASML's High-NA EUV chipmaking tools that have been championed by Intel, but the foundry is exploring the tech for future use.
According to Reuters, Zhang told attendees of the event that the A16 process technology will not need the next-generation EUV lithography tools. This implies means that TSMC has found ways to cost-efficiently use EUV double patterning and pattern shaping to increase the achievable critical dimension of a modern Low-NA litho system beyond 13nm. In contrast, Intel plans to insert High-NA EUV tools with its 14A manufacturing technology after it learns how to efficiently use them with its 18A production node.
