As announced last week by TSMC, later this year the company is set to start high-volume manufacturing on its N3P fabrication process, and this will be the company's most advanced node for a while. Next year things will get a bit more interesting as TSMC will have two process technologies that could actually compete against each other when they enter high-volume manufacturing (HVM) in the second half of 2025.
| Advertised PPA Improvements of New Process Technologies Data announced during conference calls, events, press briefings and press releases |
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| Compiled by AnandTech |
TSMC | ||||||||
| N3 vs N5 |
N3E vs N5 |
N3P vs N3E |
N3X vs N3P |
N2 vs N3E |
N2P vs N3E |
N2P vs N2 |
A16 vs N2P |
||
| Power | -25% -30% |
-34% | -5% -10% |
-7%*** | -25% -30% |
-30% -40% |
-5% -10% |
-15% -20% |
|
| Performance | +10% +15% |
+18% | +5% | +5% Fmax @1.2V** |
+10% +15% |
+15% +20% |
+5 +10% |
+8% +10% |
|
| Density* | ? | 1.3x | 1.04x | 1.10x*** | 1.15x | 1.15x | ? | 1.07x 1.10x |
|
| HVM | Q4 2022 |
Q4 2023 |
H2 2024 |
H2 2025 |
H2 2025 |
H2 2026 |
H2 2026 |
H2 2026 |
|
