TSMC reiterated its long-known stance on next-generation High-NA EUV lithography tools at its European Technology Symposium in Amsterdam. The company does not require these highest-end lithography systems for its next-generation process technologies, including A16 (1.6nm-class) and A14 (1.4nm-class) process technologies. To that end, TSMC will not adopt High-NA EUV tools for these nodes.
" People seems to always interested when TSMC going to use High-NA, I think our answer is very simple," said Kevin Zhang, Deputy Co-COO and Senior Vice President of Business Development and Global Sales, at the event. "Whenever we see High-NA will provide meaningful, measurable benefit, we will do it. With A14, the enhancement I talked about earlier is very substantial without using High-NA. So, our technology team continues to find a way to extend the life of current EUV while harvesting the scaling benefit."
