As part of the second leg of TSMC's spring technology symposium series, the company offered an update on the state of its 3nm-class processes, both current and future. Building on the back of their current-generation N3E process, the optical shrink of this process technology, N3P, is now on track to enter mass production in the second half of 2024. Thanks to that shrink, N3P is expected to offer both increased performance efficiency as well as increased transistor density over N3E.
