You might often think of processors as being relatively small, but TSMC is developing a version of its CoWoS technology that will enable its partners to build multi-chiplet assemblies that will be 9.5-reticle sized (7,885 mm^2) and will rely on 120×150 mm substrates (18,000 mm^2), which is slightly larger than the size of a CD case. TSMC claims these behemoths could offer up to 40 times the performance of a standard processor.
Virtually all modern high-performance data center-grade processors use multi-chiplet designs, and as demands for performance increase, developers want to integrate even more silicon into their products.
