TSMC will invest an additional $100 billion in the U.S. to build at least four more chipmaking plants and advanced packaging facilities in Arizona, CEO C.C. Wei announced at the company's second-quarter earnings conference in Taipei on Thursday. The new fabs will produce chips at the 2nm node and below, and the commitment lifts TSMC's total announced U.S. investment to $265 billion, confirming plans that appeared as a market rumor in February. TSMC didn’t attach a timeline, saying the pace of construction will be set by market demand.
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