TSMC will boost its chip-on-wafer-on-substrate (CoWoS) packaging capacity in reaction to skyrocketing demand from major clients like Nvidia, Apple, AMD, Broadcom, and Marvell. A report published by UDN today says the contract chipmaker will increase next year’s monthly CoWoS production targets by 20%, to 35,000 wafers per month.
In September we reported that Nvidia AI GPU shortages could persist for a year and a half due to a lack of CoWoS production capacity at TSMC. Since then, several other major chip designers have apparently been struggling to place sufficient CoWoS orders to fuel their advanced processor ambitions.
