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TechRadar
TechRadar
Ross Kelly

Top Samsung rival unveils “world’s largest capacity” 16-Layer HBM3e chips — SK hynix promises boosted performance for all

SK Hynix CEO Kwak Noh-Jung delivers a keynote speech at the SK AI Summit 2024 in Seoul, South Korea.

  • The 16-Layer HBM3e chips are expected to roll-out in 2025
  • New chips offer improved AI learning and inference capabilities
  • Users can expect lower latency, Sk hynix claims
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