A lot of the time we can boil things down to the basics when it comes to PC hardware. In general: more transistors, more power; more power, more heat; you get the idea. And today I'm reminded of another basic rule of hardware design: more surface area means better heat dissipation.
Georgia Tech has just brought to our attention (via Semiconductor Digest) a patent that was granted late last year for a means of using "microfluidic channels" to dissipate heat from a chip. This tech was developed by Dr. Daniel Lorenzini and seems to have resulted in a commercial product in the form of a "microfluidic block" from tech startup EmCool.
