Once the hotbed of chip development and manufacturing, Japan has been surpassed by the likes of Taiwan, South Korea, and the US. In a move to bring it back to the forefront of semiconductors, a new consortium has been launched, comprising 27 different firms, that will focus entirely on developing a key component in the packaging of multi-chiplet mega-processors: interposers.
The consortium, called Joint3, is being led by electrochemicals business Resonac Corporation, and it's been joined by the likes of Hitachi, Synopsys, and Zuken to research, develop, and ultimately mass-manufacture the interposers used to hook the multiple chiplets housed in mega-processors together.
