Texas Instruments will build a new $11 billion 300-millimeter semiconductor wafer fabrication plant in Lehi, Utah.
The new plant will be next to the company’s existing 300-mm semiconductor wafer fab in Lehi, which Texas Instruments acquired for $900 million in 2021 from Micron Technology. The two plants will operate together as a single plant. Construction is to begin later this year, with production planned as early as 2026.
It’s part of TI’s long-term 300-mm manufacturing roadmap, said Haviv Ilan, TI’s executive vice president and chief operating officer who becomes the company’s new president and CEO on April 1.
