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Tom’s Hardware
Tom’s Hardware
Technology
Etiido Uko

SK hynix unveils 'iHBM' thermal architecture that cools AI memory at the source — integrated cooling elements inside HBM interface cut thermal resistance by 30%, target next-gen HBM5 accelerators and dense AI data centers

SK Hynix HBM chip.

SK hynix announced iHBM today, a memory heat management technology designed to enhance AI system performance. The thermal packaging solution improves heat dissipation by integrating ICEs (integrated cooling elements) directly into the HBM package. SK hynix says the result is an over 30% reduction in thermal resistance, “ensuring stable operating characteristics even in high-temperature and high-load environments.”

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