SK Hynix has announced that it had developed the industry's first 12-layer 24GB HBM3 memory stacks that offer both high density and extreme bandwidth of 819 GB/s. The 12-Hi HBM3 products maintain the same height as the company's existing 8-layer HBM3 products, meaning that they are easy to deploy.
SK Hynix's 24GB HBM3 known good stack die (KGSD) product places twelve 16Gb memory devices connected using through silicon vias (TSVs) on a base layer with a 1024-bit interface. The device features a 6400 MT/s data transfer speed and therefore the whole 24GB HBM3 module offers a bandwidth of 819.2 GB/s.
