
SK Hynix has announced an enhanced version of its HBM3 memory that increases data transfer rate by 25% and therefore provides a sizeable performance boost for applications that uses this premium type of DRAM. Companies developing solutions for artificial intelligence (AI) and high-performance computing (HPC) will welcome HBM3E when it becomes available in 2024.
SK Hynix's HBM3E memory will increase the data transfer rate from today's 6.40 GT/s to 8.0 GT/s, which will boost per-stack bandwidth from 819.2 GB/s to 1 TB/s. Compatibility of HBM3E with existing HBM3 controllers and interfaces remains unclear, as SK Hynix has yet to reveal details about this aspect of the technology.