SK hynix has started mass production of its 12-Hi HBM3E memory stacks, ahead of its rivals. The new modules feature a 36GB capacity and set the stage for next-generation AI and HPC processors, such as AMD's Instinct MI325X which is due in the fourth quarter, and Nvidia's Blackwell Ultra which is expected to arrive in the second half of next year.
SK hynix's 12-Hi 36GB HBM3E stacks pack twelve 3GB DRAM layers and feature a data transfer rate of 9.6 GT/s, thus providing a peak bandwidth of 1.22 TB/s per module. A memory subsystem featuring eight of the company's 12-Hi 36GB HBM3E stacks will thus offer a peak bandwidth of 9.83 TB/s. Real-world products will unlikely use these HBM3E memory devices at their full speed as developers tend to ensure ultimate reliability. We don't doubt that HBM3E memory subsystems will offer higher performance than their predecessors, though.
