
Micron Technology, the Fortune 500 memory chipmaker, is breaking ground on a new high-bandwidth memory (HBM) packaging facility in Singapore. The company expects operations to begin next year with “meaningful expansion” capacity to happen in 2027. Micron will invest $7 billion in the project through to the end of the decade.
It’s the city-state’s first facility dealing with HBM, key to the AI boom that’s powering chipmakers like Nvidia and TSMC to new heights.