
Samsung Electronics (OTC:SSNLF) earmarked 25 billion yen ($170 million) to establish an advanced chip packaging R&D center in Yokohama, Japan, intensifying its competition with Taiwan Semiconductor Manufacturing Co (NYSE:TSM) in the packaging market.
The global advanced chip packaging market is forecast to grow from $34.5 billion in 2023 to $80 billion by 2032.