Samsung Electro-Mechanics is fast-tracking its venture into the semiconductor glass substrate market, advancing its equipment procurement and installation to September and starting to operate its pilot line in the fourth quarter, a quarter ahead of the initial plan, reports ETNews. The company expects to start production of glass substrates for high-end system-in-packages (SiPs) in 2026. To land orders for 2026, the company needs to demonstrate decent capabilities in 2025.
To build highly-complex multi-chiplet SiPs, Samsung needs to gain expertise in glass substrates. Therefore, the company's decision to move up the timeline for its pilot line at Sejong, South Korea, fab could be a strategic one and could reflect the growing importance of advanced chip packaging technologies for Samsung as well as the company's aggressive attempt to capture market share from Intel, which is on track to start offering advanced packaging on glass substrates in the coming years.
