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Tom’s Hardware
Tom’s Hardware
Technology
Zhiye Liu

Ryzen 7000 I/O Die Cracks Into Five Tiny Chiplets During Experiment

Ryzen 5 7600

Fritzchens Fritz, famous for his IR photography of processors, recently shared an image comparing the Ryzen 5 7600 to the Ryzen 7 7800X3D. The renowned photographer described an unfortunate event with his Ryzen 5 7600. The hexa-core chip's I/O Die had cracked unexpectedly during some tests before taking thermal images of the processor. However, it's important to note that Fritz's experience doesn't indicate any issue with the Ryzen 7000 processors.

Fritz delidded the Ryzen 5 7600 and ran it with Thermal Grizzly's Ryzen 7000 Direct Die Frame without a heatsink. He noted that the I/O Die (IOD) temperature was approximately 80 degrees Celsius, while the single Core Complex Die (CCD) thermally throttled to 95 degrees Celsius. He was using thermal imaging to capture the bouncing of the cores. The Ryzen 5 7600 was executing the Cinebench single-core test and produced image artifacts, and eventually crashed the system after 60 seconds.

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