Samsung is set to introduce 3D packaging services for high-bandwidth memory (HBM) this year, according to a report from the Korea Economic Daily that cites the company's announcement at the Samsung Foundry Forum 2024 in San Jose, as well as 'industry sources.' The 3D packaging for HBM essentially paves the way for HBM4 integration in late 2025 – 2026, but we are not sure what kind of memory Samsung is set to package this year.
For 3D packaging, Samsung has a platform called SAINT (Samsung Advanced Interconnect Technology) that includes three distinct 3D stacking technologies: SAINT-S for SRAM, SAINT-L for logic, and SAINT-D for DRAM stacking on top of logic chips like CPUs or GPUs. The company has been working on SAINT-D for several years (and formally announced it in 2022) and it looks like the technology will be ready for prime time this year, which will be a notable milestone for the world's largest memory maker and a leading foundry.
