Rapidus, which positions itself as a vertically integrated chipmaker that offers both front-end semiconductor production and back-end packaging, plans to discuss its efforts in the field of panel-level packaging (PLP) on glass substrates at SEMICON Japan event this week, reports Nikkei. Panel-level packaging on glass substrates is among the most advanced chip packaging technologies that is set to emerge in the coming years.
The core of Rapidus's development is 600mm x 600mm glass panels that are used to make substrates for high-end multi-chiplet processors, such as those used for AI and HPC accelerators. This means that Rapidus plans to leap ahead of its rivals using both panel-level packaging and glass core substrates, which is a risky, but perhaps necessary move, as the company only plans to offer leading-edge process technologies and the most sophisticated packaging technologies for customers who need them. The company has been experimenting with glass panels since June, so its PLP and glass-related efforts are at the very early stages.
