The physical economy is undergoing a permanent shift. Legacy silicon power components are hitting their thermodynamic limits. Wide-bandgap materials like silicon carbide and gallium nitride are stepping in to handle higher voltages and temperatures with significantly less energy loss.
This transition serves as the critical bottleneck for next-generation technologies. With the total addressable market for wide-bandgap applications projected to exceed $20 billion by 2030, the battle to control the underlying intellectual property is rapidly escalating.
