Visakhapatnam | Bengaluru: Construction has begun on South India's first semiconductor packaging facility under the India Semiconductor Mission, with Prime Minister Narendra Modi on Saturday virtually laying the foundation stone for ASIP Technologies' ₹2,387-crore project in Visakhapatnam.
The outsourced semiconductor assembly and test (OSAT) facility at Tarluvada, being developed with South Korea's APACT as technology partner, will package and test chips for artificial intelligence, high-performance computing, data centres and high-speed communications.
