South Korean memory giant SK Hynix has announced it has begun the mass production of the world’s first 12-layer HBM3E, featuring a total memory capacity of 36GB, a huge increase from the previous 24GB capacity in the 8-layer configuration.
This new design was made possible by reducing the thickness of each DRAM chip by 40%, allowing more layers to be stacked while maintaining the same overall size. The company plans to start volume shipments by the end of 2024.
