As Nvidia ramps up production of its multi-chiplet Blackwell-series products, the company will use more CoWoS-L packaging capacity and less CoWoS-S packaging capacity, the company's chief executive Jensen Huang confirmed at a press conference in Taiwan.
"As we move into Blackwell, we will use largely CoWoS-L," said Huang at a press conference dedicated to the official opening of an advanced packaging facility by Siliconware Precision Industries Limited (SPIL), a subsidiary of ASE Technology, reports Reuters. "Of course, we are still manufacturing Hopper, and Hopper will use CowoS-S. We will also transition the CoWoS-S capacity to CoWoS-L. So it is not about reducing capacity. It's actually increasing capacity into CoWoS-L."
