
Taiwan Semiconductor Manufacturing Co. (NYSE:TSM) is reportedly facing overwhelming demand for its Chip on Wafer on Substrate or CoWoS advanced packaging technologies as companies including Nvidia Corp. (NASDAQ:NVDA), Alphabet Inc.'s (NASDAQ:GOOG) (NASDAQ:GOOGL) Google, Amazon.com Inc. (NASDAQ:AMZN) and MediaTek race to secure capacity for next-generation AI chips.