One of the world's biggest laptop ODMs has won an iF Design Award for its innovative laptop cooling enhancement technology, reports Liliputing. Taiwan's Wistron has revealed its new Dynamic Airflow system, based on the concept of a 'Hinge Auto-Extension,' in a series of laptop renders. The images show that when a user opens up a clamshell laptop the rear 'shelf' heat module gets extended to boost airflow.
Wistron's iF Design Award product description text is fairly brief. It presents the cooling problem in a typical laptop design where the motherboard and thermal component overlap. The solution it has come up with takes them out of alignment as the laptop is opened, and allows for much greater airflow.
