Micron Technology has introduced its new multiplexed rank dual inline memory modules (MRDIMMs) designed to combine high performance, low latency, high capacity, and predictable power consumption for next-generation Intel Xeon 6 server platforms. As the number of cores per socket rise, the new modules will be particularly useful to ensure decent per-core memory bandwidth, which will be valuable for artificial intelligence (AI) and high-performance computing (HPC) applications.
MRDIMMs are JEDEC-standardized next-generation memory modules that essentially feature two DDR ranks that run in a multiplexed mode to double the speed. To enable such operation, the modules are equipped not only with more memory devices, but also with an MRCD chip that allows simultaneous access to both ranks and MDB chips that enable muxing and demuxing. The host CPU interacts with an MRDIMM module at an 8800 MT/s data transfer rate (for the first generation, the next generation expected to reach 12800 MT/s), but all the components on the module work at half the rate, enabling to tighter latencies and keeping power consumption of the module in check.
