This week, Micron provided an update on its HBM4 and HBM4E programs. The next-generation HBM4 memory, with a 2048-bit interface, is on track for mass production in calendar year 2026, with HBM4E to follow in subsequent years. In addition to offering higher data transfer rates than HBM4, HBM4E will also introduce an option to customize its base die, marking a paradigm shift for the industry.
Without a doubt, HBM4 impresses with its 2048-bit memory interface. However, HBM4E will be even more impressive, enabling Micron to offer customized base dies for certain customers, thus providing more optimized solutions with potentially additional features. The custom logic dies are set to be made by TSMC using an advanced node, allowing them to pack more caches and logic for added performance and functionality.
