Micron, Samsung, and SK hynix have introduced their small outline compression attached memory modules (SOCAMM) that use LPDDR5X memory and are aimed at AI and low-power servers. SOCAMMs — which will first be used with servers based on Nvidia's GB300 Grace Blackwell Ultra Superchip systems — are designed to bring together high capacity, high performance, small footprint, and low power consumption.
A SOCAMM measures 14x90mm — one-third of a traditional RDIMM — and carries up to four 16-die LPDDR5X memory stacks. Micron's initial SOCAMM modules will offer a capacity of 128GB and will rely on the company's LPDDR5X memory devices produced on its 1β (1-beta, 5th Generation 10nm-class) DRAM process technology. Micron does not disclose data transfer rates supported by its initial SOCAMM sticks but says that their memory is rated for up to 9.6 GT/s. Meanwhile, SK hynix's SOCAMM demonstrated at GTC 2025 is rated for up to 7.5 GT/s.
