
Kioxia and its research and manufacturing partner Western Digital plan to reveal their innovations that will enable higher-capacity and higher-performance 3D NAND memory devices at the upcoming 2023 Symposium on VLSI Technology and Circuits. Engineers from the two companies are looking to enable 8-plane 3D NAND devices as well as 3D NAND ICs with over 300 word-lines, reports eeNewsEurope.