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Tom’s Hardware
Tom’s Hardware
Technology
Anton Shilov

Kioxia and WD to Present Details on 3D NAND With 300+ Layers

Western Digital

Kioxia and its research and manufacturing partner Western Digital plan to reveal their innovations that will enable higher-capacity and higher-performance 3D NAND memory devices at the upcoming 2023 Symposium on VLSI Technology and Circuits. Engineers from the two companies are looking to enable 8-plane 3D NAND devices as well as 3D NAND ICs with over 300 word-lines, reports eeNewsEurope.

Eight-Plane 3D NAND: Up to 205 MB/s

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