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Tom’s Hardware
Tom’s Hardware
Technology
Luke James

Intel, SK hynix shares surge following reports of chip packaging partnership — SK is said to be testing Intel's 2.5D EMIB for HBM integration

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Share prices of both Intel and SK hynix have surged following a ZDNet Korea report claiming that SK is conducting R&D with Intel on 2.5D packaging using Intel's Embedded Multi-die Interconnect Bridge (EMIB) technology, with the intention of integrating high-bandwidth memory (HBM) and logic semiconductors. Citing unnamed industry sources, ZDNet Korea reports that the company is also evaluating the materials and components required for production.

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