
Share prices of both Intel and SK hynix have surged following a ZDNet Korea report claiming that SK is conducting R&D with Intel on 2.5D packaging using Intel's Embedded Multi-die Interconnect Bridge (EMIB) technology, with the intention of integrating high-bandwidth memory (HBM) and logic semiconductors. Citing unnamed industry sources, ZDNet Korea reports that the company is also evaluating the materials and components required for production.
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