Intel's embedded multi-die interconnect bridge (EMIB) advanced packaging technology is already used for multiple products designed by the company itself, but its widespread adoption by Intel Foundry customers requires it to be supported by third-party electronic design automation (EDA) tools and reference flows. On Monday, Intel said that software from Ansys, Cadence, Siemens, and Synopsys now supports its EMIB chiplet-to-chiplet interconnections, which is useful for various AI and HPC processors.
Intel's EMIB technology is designed to connect and integrate multi-chiplet designs in a single package in a relatively simple and cost-effective manner through the use of an embedded silicon bridge that connects chiplets. Intel says that diverse design tools, methodologies, and reusable IP blocks from companies like Ansys, Cadence, Siemens, and Synopsys are now fully enabled and qualified to support customers using Intel EMIB packaging technology for their projects.
