Intel is looking to the future, aiming to make PCs more modular and easier to repair in a move to reduce e-waste. According to the company’s Community post, it is proposing to separate the all-in-one motherboard designs used in laptops into three pieces. It’s also suggesting that mini-PCs, which are traditionally highly integrated and often difficult or impossible to repair or upgrade, be separated into different modules. This move will make these systems far easier to service and would also hopefully reduce the massive amount of e-waste generated each year.
Aside from reparability and upgradability, Intel also claims that its scalable designs for laptops will help reduce the engineering efforts made by their partners.
