Intel has made significant strides in implementing High-NA EUV lithography by installing two High-NA litho machines, developing custom reticles as well as all-new optical proximity correction, and processing 30,000 wafers. However, major hurdles remain: the $380 million – $400 million tool cost and potential necessity to overhaul photomask supply chain limits economic viability of the technology. Furthermore, a single High-NA EUV exposure costs 2.5 times more than a single Low-NA EUV exposure, which raises further questions about economic feasibility over the next few years, reports SemiAnalysis.
